Energy storage inverter packaging

What technology trends have been observed in power module packaging?

Although no major packaging technology breakthrough has been observed over the last several months, many technology trends from the past have been confirmed. EV/HEV applications are increasingly driving the technology trends in power module packaging, where high power density and highly reliable power module packages are needed.

What is the best substrate for power module packaging?

In terms of substrate, the most common choice for power module packaging is Al 2O DBC (direct-bonded copper). As shown in this report, the industry is moving towards materials offering better mechanical stability and higher thermal conductivity (i.e. AlN AMB (active metal brazed), Si3N 4, AMB).

What is power module packaging?

Power module packaging solutions are moving towards high-performance materials and reduction of the number of layers, size, and interfaces, while conserving electrical, thermal, and mechanical characteristics. In terms of substrate, the most common choice for power module packaging is Al 2O DBC (direct-bonded copper). As shown

How will the power module packaging material market perform in 2024?

The power module packaging material market will achieve a 2018 - 2024 CAGR of 7.8%, reaching the $2.17B business opportunity by 2024 and representing more than one-third of the power module market. In terms of technology and market forecast, this

What is the outlook for the power module packaging material market?

This market’s promising outlook is beneficial for the power module packaging material business, which Yole Développement covers in this report. The power module packaging material market will achieve a 2018 - 2024 CAGR of 7.8%, reaching the $2.17B business opportunity by 2024 and representing more than one-third of the power module market.

Why is silver sintering used in power module packaging?

STATUS OF THE POWER MODULE PACKAGING INDUSTRY 2019 substrate for low- and mid-power devices. In order to make the power module package more stable thermally, and to take advantage of SiC’s properties, reliable and robust die attach is required. Therefore, the use of silver sintering is increasing.