Thermoelectric decoupling technology development energy storage

How can a thermoelectric device reduce performance degradation?

This performance degradation can be mitigated by optimizing interfaces between thermoelectric materials and electrodes. This review discusses interdependent optimization strategies across the material, module, and device levels.

How do material module and device levels influence the efficiency of thermoelectric systems?

Detailed interdependent influences among material, module, and device levels are presented in the graphical abstract. The three levels interact with each other and collectively influence the efficiency of thermoelectric systems. Implementing effective optimization strategies at the material, module, and device levels is of great importance.

Can high-entropy effects optimize Electrical and thermal properties in thermoelectric materials?

We then classify the examples where high-entropy effects can optimize electrical, thermal, and mechanical properties in thermoelectric materials. Following this, we summarize the overall advances that the high-entropy strategy has brought to thermoelectric materials and devices.

Can phase-change materials be used in thermoelectric devices?

The application of phase-change materials (PCMs) may be an effective solution to this challenge, as the heat storage and release processes of PCMs enable the cyclic variation of the heat source. In practical applications, the temperature environment of thermoelectric modules and materials is closely linked to the device design.

What is the application of thermoelectric technology?

The application of thermoelectric technology is closely related to materials’ thermoelectric and mechanical properties. However, the strong coupling of key parameters involving charge carriers and phonon transport hinders the substantial improvements in overall thermoelectric performance.

How to optimize thermoelectric performance at the module and device levels?

Implementing effective optimization strategies at the material, module, and device levels is of great importance. The concepts of compatibility 21 and effective thermal conductivity 22 provide effective methods for designing and optimizing thermoelectric performance at the module and device levels.