Flexible phase change energy storage materials

Flexible phase change energy storage materials

In this article, we systematically reviewed these strategies including (1) confinement of rigid PCM into flexible porous scaffolds, (2) encapsulation of PCM into elastic shells, and (3) development of intrinsically flexible PCM based on molecularly engineered structures.

6 FAQs about [Flexible phase change energy storage materials]

Why are phase change materials used in thermal energy storage?

Phase change materials (PCMs) have been widely used in various fields of thermal energy storage because of their large latent heat value and excellent temperature control performance. Based on the microstructure packaging strategy, PCMs are developed into shape-stabilized PCMs, which can solve the problem of leakage when phase change occurs.

Can phase change materials be used for latent heat thermal energy storage?

Phase change materials (PCMs) have been extensively explored for latent heat thermal energy storage in advanced energy-efficient systems.

What is a phase change composite?

Flexible Phase Change Composites with Excellent Thermal Energy Storage for the Thermal Management of Electronic Devices Phase change materials (PCMs) are used in the field of thermal management because of their ability to absorb and release thermal energy through latent heat.

Are phase change materials suitable for thermal management?

With the increasing demand for thermal management, phase change materials (PCMs) have garnered widespread attention due to their unique advantages in energy storage and temperature regulation. However, traditional PCMs present challenges in modification, with commonly used physical methods facing stability and compatibility issues.

Are flexible polymeric solid–solid phase change materials suitable for flexible/wearable devices?

Flexible polymeric solid–solid phase change materials (PCMs) have garnered continuous attention owing to their potential for thermal management in flexible/wearable devices and their non-leakage characteristics. However, it is still a big challenge to obtain polymeric solid–solid PCMs with both flexibility and high latent heat.

Are flexible phase change composites suitable for thermal management of electronic devices?

However, the rigidity and leakage issues of PCMs limit their application in thermal management of electronic devices. In this paper, we prepared flexible phase change composites with excellent thermal management capabilities by mixing phase change microparticles with addition-cure liquid silicone rubber (ALSR).

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