Image of the heat dissipation channel of the energy storage power supply

What are the heat transfer and heat dissipation channels of forced air cooling?

The heat transfer and heat dissipation channels of forced air cooling are as follows: DC/DC module interior → module shell → graphene → surface of Mg–Al alloy cold plate → fin structure → internal environment of the chassis → Mg–Al alloy surface of the case → external environment of the case.

How does heat dissipation efficiency affect power supply performance?

Heat-dissipation efficiency has a direct impact on the performance of a power supply. Electronic circuits often perform more efficiently at lower temperatures and will in turn tend to dissipate less energy as wasted heat.

Can heat dissipation system improve the performance of power array?

The results show that the heat dissipation system can effectively improve the heat dissipation condition and reduce the working temperature of the whole system without sacrificing the performance and can meet the requirements of fast response and continuous and efficient output power of the power array.

What is physical structure heat dissipation?

Physical structure heat dissipation can be divided into natural air cooling, conduction cooling, forced air cooling, circulating water cooling, and so on. Natural air cooling mainly transfers heat from the power module shell to the air through natural convection or conducts it to the PCB through pins.

Does heat dissipation design work in high-temperature and high-load environment tests?

The results show that the heat dissipation design in this article can work normally in high-temperature and high-load environment tests. Finally, the existing cooling designs are compared and analyzed. The cooling performance parameters in this article are better than those in the existing case.

What is a heat dissipation case?

The design of existing small electronic thermal methods ignores high-temperature and high-load environment tests without automation control. To solve these problems, a heat dissipation case is designed with a magnesium and aluminum alloy, for intelligent temperature control based on a high-power and high-density power supply array.