Energy storage bolt copper plating thickness

How thick should a copper underplate be?

Those deposits with less will rust fairly quickly, especially in moist environments. If you have an especially poor base, a thickness of greater than 0.0005″ may be required. The use of multi-layer systems such a copper underplate prior to a nickel or tin topcoat, will reduce the overall porosity and enhance corrosion performance.

What are the requirements for cu plating process?

Requirements for Cu plating process Another process point for this fabrication is double side electroplating. To suppress wafer warpage due to Cu film stress it is necessary to be able to process simultaneous both sides plating and also it is desirable to be able to adjust plating thickness on each side of wafer surface.

What is cu double side plating structure?

As shown in Fig. 1 we have developed Cu double side plating structure [10-12]. This consists of 20 m thick Cu plating layers on both sides of devices with 50 m thick Si substrate. Fig. 2 shows process flow of Cu double side plating.

How can a copper underplate improve corrosion performance?

The use of multi-layer systems such a copper underplate prior to a nickel or tin topcoat, will reduce the overall porosity and enhance corrosion performance. In addition, selection of a more corrosion resistant topcoat such as high phosphorus electroless nickel plating services, can improve corrosion performance.

How is cu plating done?

Therefore, front side patterning is processed at first. After that, simultaneous both sides Cu plating is done by double side plating equipment (fig. 2-d). The thickness of both plates is about 20 m. After that back side patterning is processed in order to get rid of Cu plates in dicing region (fig.2-e).

How to test the bond strength between copper cladding and substrate?

An electronic universal testing machine (MTS CMT6103) was used to measure the peel strength between the coating and the substrate. The bond strength between the copper cladding and the substrate was analyzed using a Bagel knife (Aipli QFH-A).